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No need for heat-resistant tape application process!
"Magic Resin Carrier" is a new type of carrier that securely adheres to the substrate. It is ideal for transporting flexible substrates and thin substrates, such as FPC mounting, COF mounting, TCP mounting, and thin PWB.
Essential item for FPC implementation process! Temporary fixation of the circuit board is possible without the need for tapes!
We offer the 'SMT Board,' a carrier for substrate transport that achieves high heat resistance and excellent adhesion through our unique construction method. It allows for temporary fixation of substrates on the carrier without using tapes typically employed in the assembly process. Additionally, the board materials can be widely selected from heat-resistant glass epoxy, aluminum, and stainless steel. 【Features】 ■ A wide selection of board materials including heat-resistant glass epoxy, aluminum, and stainless steel ■ Adhesive strength can be adjusted to accommodate FPC materials and component conditions ■ Can be selected with bake materials or aluminum materials, enhancing pin reference accuracy to achieve multiple placements with a 0.4mm pitch ■ Custom design and manufacturing according to the customer's production method, with the possibility of combining with metal masks for supply *For more details, please download the PDF or feel free to contact us.
